IC Design | Advanced IC Packaging | Siemens

Semiconductor Digital Thread

IC Design and Advanced Packaging

Conquer IC design challenges. Address integrated chip design complexity and manufacturing scalability while improving yield and lowering costs.

Accelerate IC design and new package introductions NPI

In today's competitive semiconductor landscape, bringing innovative IC designs and advanced packages to market quickly is crucial for maintaining market leadership. As design complexity increases and time-to-market windows shrink, engineering teams need integrated solutions that streamline workflows from concept to manufacturing. You can accelerate innovation while ensuring quality.

From ic design to manufacturing

End-to-end traceability from ic design to manufacturing

Managing complexity in semiconductor design requires robust traceability from concept to manufacturing. Increase visibility to optimize designs and enable advanced packaging integration, helping accelerate innovation while maintaining quality.

16-9

16-9 Metal layer reduction achieved

Drive design optimization by enabling significant metal layer reduction while maintaining advanced semiconductor functionality. ( Chipletz)

2 in 1

2 in 1 Device area reduction

Enable complete traceability across stacked silicon dies, delivering greater system performance and functionality while reducing power consumption and PCB space. ( United Microelectronics)

40x

40x Enhance productivity

Built on a foundation of intelligent, fast and accurate data and technology, using Simcenter FLOEFD helps reduce the overall simulation time by as much as 75 percent and enhances productivity by up to 40x. ( Chipletz)

Innovative semiconductor solutions

Optimize the semiconductor development process

A comprehensive semiconductor design and manufacturing solution ensures seamless integration across all stages, from concept to production. By leveraging a holistic approach, semiconductor companies can accelerate ic design, refine 3D IC packaging and achieve manufacturing excellence.

IC Design innovation

Empower next-gen success

Achieving Manufacturing Excellence

A comprehensive approach to IC design innovation combines integrated project management, cross-domain collaboration and digital twin technology to accelerate semiconductor development and unlock new business opportunities. Our solution helps you:

Drive faster development cycles through real-time collaboration across product teams, quality, process engineering and manufacturing in a semiconductor-specific environment.
Leverage digital twin technology to optimize designs from chip-level through advanced IC, enabling seamless integration from specification to fabrication.
Embed sustainability early in product design to significantly reduce environmental impact while meeting performance goals.
Streamline NPI success with automated project management templates, out-of-the-box metrics, and unified program delivery platforms.

Benefits of unified IC design and advanced packaging

$1T

$1T Industry growth by 2030

Leverage unified design and advanced packaging solutions to capitalize on unprecedented semiconductor market growth, particularly in automotive, computing and wireless sectors.

180K

180K Device pins managed

Enable comprehensive design validation across highly complex semiconductor packages through unified solutions that streamline integration while maintaining quality and performance.

30%

30% Reduce time-to-market

Drive innovation through unified design and advanced packaging to meet aggressive growth demands.

Case Study

Smarter, faster, greener AI with 3D IC chiplet advanced packaging

Company: ETRI and Amkor

Industry: Electronics, Semiconductor devices

Location: USA, South Korea

Siemens Software: Calibre, Xpedition IC Packaging

Read

Siemens IC packaging design tools helped us provide a fast and high-quality design service to our customers even with large body and chiplet package structures.

JaeBeom Shim, Package Design Manager, Amkor Korea

IC design engineering

Explore our resource library

Accelerate IC design innovation through our comprehensive resource library. Access practical guides, technical deep-dives, and real-world case studies that showcase proven approaches to today's semiconductor challenges. Drive efficiency, optimize manufacturing readiness and streamline development cycles with expert insights tailored to your needs.

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IC design and manufacturing solutions

Frequently asked questions

What is the importance of identifying chip defects early on in the IC design and verification process?

Identifying chip defects early in the IC design and verification process is crucial for minimizing costs, accelerating time-to-market, and ensuring optimal quality and reliability. Studies have shown that catching and resolving issues during the initial design phase can be orders of magnitude cheaper than discovering problems later in manufacturing or after production. Early defect detection allows designers to optimize the IC layout, address potential manufacturing issues and improve chip performance before committing to silicon. Furthermore, proactive verification helps ensure that the design intent is properly captured and that the chip will function as intended when manufactured. This reduces the risk of costly design iterations and delays that can impact project schedules and budgets. As chip complexity continues to increase, advanced verification techniques, become even more critical for identifying and resolving issues efficiently in today's sophisticated IC designs.

How can an integrated digital thread help IC designers leverage semiconductor ip reuse practices?

An integrated digital thread can significantly enhance semiconductor IP reuse practices by providing a centralized, unified platform for managing and accessing IP assets across the entire design lifecycle. By consolidating design data, documentation, and metadata within a single system, IC designers can more easily search for, evaluate and incorporate existing IP into new designs. This streamlined IP management approach reduces duplication of effort, facilitates collaboration between teams, and ensures that designers are working with the most up-to-date and validated IP versions. Comprehensive IP tracking and versioning capabilities, as discussed in a recent Siemens podcast on the Chiplet Design Exchange, enable designers to quickly identify and resolve any integration issues that may arise during the design process.

How can a holistic chip design and manufacturing solution accelerate IC and SoC development?

A holistic chip design and manufacturing solution can accelerate IC and SoC development by integrating and optimizing the entire design-to-manufacturing flow. By unifying design, verification, and manufacturing processes within a single environment, designers can seamlessly transition between stages, minimizing data transfer overhead and reducing the risk of errors. Advanced design automation and verification tools, tightly coupled with manufacturing models and rules, enable designers to make informed decisions early in the development process. This holistic approach allows for concurrent optimization of design performance, manufacturability, and yield. By proactively addressing potential manufacturing issues and leveraging simulation-driven design techniques, IC and SoC development cycles can be significantly compressed, accelerating time-to-market.

Prior to chip tapeout, what is the significance of streamlining collaboration between ic designers?

Streamlining collaboration between IC designers before chip tapeout is crucial for ensuring design integrity, minimizing errors, and avoiding costly iterations. Effective collaboration enables designers to share knowledge, synchronize their efforts, and make informed decisions considering the interdependencies between different design aspects. By establishing clear communication channels, standardized design practices, and efficient data-sharing mechanisms, IC designers can work together seamlessly to resolve issues, optimize performance and validate the overall design. Collaborative tools and platforms facilitate cross-functional teamwork and ensure that all stakeholders have visibility into the design progress and can contribute their expertise effectively.

How will adopting integrated semiconductor design and manufacturing solutions innovate chiplet packaging?

Adopting integrated semiconductor design and manufacturing solutions will revolutionize chiplet packaging by enabling a more holistic and optimized approach to multi-die integration. These solutions bring together advanced packaging design tools, 3D modeling capabilities, and manufacturing process simulations, allowing designers to explore and refine chiplet layouts and interconnects in the context of the full package assembly. By considering the electrical, thermal, and mechanical aspects of chiplet integration in a unified design environment, engineers can make informed decisions that optimize performance, power efficiency, and signal integrity. Integrated solutions also facilitate the co-design and co-optimization of chiplets and their packaging, enabling the creation of highly customized and application-specific multi-die systems.

What new approaches could semiconductor manufacturers take to improve semiconductor yield?

Semiconductor manufacturers could adopt several innovative approaches to improve semiconductor yield, focusing on advanced process control, data-driven optimization and predictive analytics. One promising strategy is to implement real-time process monitoring and closed-loop control systems that can dynamically adjust manufacturing parameters based on in-line sensor data. By leveraging machine learning algorithms and advanced statistical models, manufacturers can identify and correct process deviations before they impact yield. Another approach is to invest in comprehensive data collection and analysis infrastructure, enabling manufacturers to gain deep insights into the factors influencing yield across multiple production lines and facilities. By correlating process data, metrology results, and test outcomes, engineers can identify the root causes of yield issues and implement targeted improvements. Additionally, manufacturers could explore the use of predictive maintenance techniques to minimize unplanned downtime and ensure consistent process performance. By analyzing equipment sensor data and historical maintenance records, manufacturers can optimize maintenance schedules and proactively address potential issues before they affect production.